NEW DELHI (India CSR): The Union Cabinet, chaired by Prime Minister Narendra Modi, has approved four major semiconductor manufacturing projects under the India Semiconductor Mission (ISM) with a total investment of Rs. 4,600 crore. The projects, proposed by SiCSem, Continental Device India Ltd. (CDIL), 3D Glass Solutions Inc., and Advanced System in Package (ASIP) Technologies, will be set up in Odisha, Punjab, and Andhra Pradesh. Expected to create 2,034 direct jobs, these projects will strengthen India’s semiconductor ecosystem, reduce import dependence, and complement the country’s growing chip design capabilities, propelling India closer to becoming a global leader in semiconductor manufacturing.
India’s Expanding Semiconductor Mission
The India Semiconductor Mission, launched to attract global and domestic investments in semiconductor manufacturing, is witnessing strong momentum. With these four approvals, the total sanctioned projects under ISM have reached ten, spanning six states with cumulative investments worth Rs. 1.60 lakh crore. The newly approved units will produce high-value semiconductor components, essential for industries such as telecom, automotive, defence, data centres, and renewable energy. This expansion comes at a crucial time when global semiconductor demand is surging, driven by technological advancements and the rapid adoption of electronics in multiple sectors.
Odisha: Hub for Compound Semiconductors and Packaging
Odisha will host two of the approved projects — SiCSem and 3D Glass Solutions Inc. SiCSem, in collaboration with Clas-SiC Wafer Fab Ltd., UK, will establish India’s first commercial compound semiconductor fabrication unit in Bhubaneswar’s Info Valley. The facility will produce Silicon Carbide-based devices with an annual capacity of 60,000 wafers and packaging for 96 million units. These products will be used in electric vehicles, defence systems, renewable energy equipment, and high-speed charging infrastructure, marking a milestone in India’s entry into the compound semiconductor space.
Advanced Packaging Facility by 3D Glass
3D Glass Solutions Inc. will set up a vertically integrated advanced packaging and embedded glass substrate unit, also in Info Valley, Bhubaneswar. Bringing some of the most sophisticated semiconductor packaging technologies to India, the facility will produce glass interposers, silicon bridges, and 3D Heterogeneous Integration (3DHI) modules. With a planned capacity of 69,600 glass panel substrates, 50 million assembled units, and 13,200 3DHI modules annually, this unit will serve industries such as defence, artificial intelligence, automotive electronics, photonics, and high-performance computing. It is expected to position India at the forefront of advanced semiconductor packaging.
Punjab Expansion in Discrete Semiconductors
Continental Device India Ltd. (CDIL) will expand its Mohali facility in Punjab to produce high-power discrete semiconductor devices, including MOSFETs, IGBTs, Schottky Bypass Diodes, and transistors in both silicon and silicon carbide variants. The expansion will enable the production of 158.38 million units annually, serving automotive electronics, renewable energy systems, industrial machinery, and communication networks. This project will strengthen Punjab’s role as a semiconductor manufacturing hub and support India’s transition towards energy-efficient and sustainable electronic solutions, particularly in the growing electric vehicle and renewable energy segments.
Andhra Pradesh Gets Advanced Packaging Unit
Advanced System in Package Technologies (ASIP) will establish a semiconductor manufacturing unit in Andhra Pradesh in partnership with APACT Co. Ltd., South Korea. The facility, with a capacity of 96 million units per year, will produce semiconductor components for mobile phones, set-top boxes, automotive electronics, and consumer devices. The collaboration with a leading South Korean technology firm will enable knowledge transfer and introduce cutting-edge packaging solutions to India. This project will not only cater to domestic demand but also position India as a competitive exporter in the global semiconductor supply chain.
Boost to Talent and Design Ecosystem
These projects will complement India’s growing chip design ecosystem, which is supported by government initiatives across 278 academic institutions and 72 start-ups. Over 60,000 students have already benefited from the talent development programme under ISM, ensuring a steady pipeline of skilled professionals for the semiconductor industry. The newly approved units will help retain this talent within the country while creating additional indirect employment opportunities across supply chains. By fostering innovation, research, and manufacturing, India is building the foundation to emerge as a self-reliant, globally competitive semiconductor powerhouse.
| Company / Project | Location | Investment (₹ Crore) | Capacity | Key Applications |
|---|---|---|---|---|
| SiCSem Pvt. Ltd. | Bhubaneswar, Odisha | 1,150 | 60,000 wafers/year, 96M packaged units | Defence, EVs, Railways, Fast Chargers, Data Centres, Consumer Appliances, Solar Inverters |
| 3D Glass Solutions Inc. | Bhubaneswar, Odisha | 1,150 | 69,600 glass substrates/year, 50M assembled units, 13,200 3DHI modules | Defence, AI, RF & Automotive, Photonics, High-Performance Computing |
| Continental Device India Ltd. (CDIL) | Mohali, Punjab | 1,150 | 158.38M units/year | Automotive Electronics, Renewable Energy, Power Conversion, Industrial & Communication |
| Advanced System in Package Technologies (ASIP) | Andhra Pradesh | 1,150 | 96M units/year | Mobile Phones, Set-top Boxes, Automotive, Consumer Electronics |
10 Key Facts – ₹4,600-Crore Semiconductor Boost in Three States
- Total Investment – The Union Cabinet has approved four semiconductor projects with a combined outlay of ₹4,600 crore under the India Semiconductor Mission (ISM).
- Project Locations – The units will be set up in Bhubaneswar (Odisha), Mohali (Punjab), and Andhra Pradesh.
- Companies Involved – The projects are led by SiCSem Pvt. Ltd., 3D Glass Solutions Inc., Continental Device India Ltd. (CDIL), and Advanced System in Package Technologies (ASIP).
- Odisha’s First Commercial Compound Fab – SiCSem will build India’s first commercial Silicon Carbide (SiC) compound semiconductor fab with a capacity of 60,000 wafers/year and 96 million packaged units/year.
- World-Class Advanced Packaging in Odisha – 3D Glass Solutions Inc. will set up a vertically integrated advanced packaging and embedded glass substrate unit with a capacity of 69,600 glass substrates/year, 50 million assembled units, and 13,200 3DHI modules/year.
- Punjab Facility Expansion – CDIL will expand its Mohali plant to produce 158.38 million units/year of high-power discrete semiconductor devices like MOSFETs, IGBTs, and Schottky diodes.
- South Korea Collaboration in Andhra Pradesh – ASIP, in partnership with APACT Co. Ltd., South Korea, will manufacture 96 million units/year for mobile, automotive, and consumer electronics.
- Applications Across Sectors – Products from these units will be used in defence systems, electric vehicles, renewable energy, AI, high-performance computing, telecom, and consumer electronics.
- Job Creation – These projects are expected to generate 2,034 direct jobs for skilled professionals, along with many indirect jobs in the electronics manufacturing supply chain.
- National Semiconductor Push – With these approvals, India now has 10 sanctioned semiconductor projects across six states with cumulative investments of ₹1.60 lakh crore, strengthening the country’s position in the global semiconductor value chain.
(India CSR)
